User's Manual

SU60-SIPT
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
39
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Europe: [phone]
Hong Kong: [phone]
Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground
via number when using laser via on HID process. More ground via and the use of 1-oz copper is recommended in
our design to get better thermal dissipation.
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
14 RF L AYOUT D ESIGN G UIDELINES
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your
device.
 Do not run antenna cables directly above or directly below the radio.
 Do not place any parts or run any high speed digital lines below the radio.
 If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the
devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between
these two antennas.
 Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio
from the antenna. In addition, do not place antennas directly above or directly below the radio.
 Laird recommends the use of a double-shielded cable for the connection between the radio and the
antenna elements.
 Be sure to put a 10uF capacitor on EACH 3.3V power pin. Also, place that capacitor to the pin as close as
possible to make sure the internal PMU working correctly.
 Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.
 To get maximum throughput when operate at MIMO 2x2, two antennas with at least 25 dB isolation is
recommended.
 To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic
objects or components.
15 R ECOMMENDED S TORAGE , H ANDLING , B AKING , AND R EFLOW P ROFILE
15.1 Required Storage Conditions
15.1.1 Prior to Opening the Dry Packing
The following are required storage conditions prior to opening the dry packing:
 Normal temperature: 5~40℃
 Normal humidity: 80% (Relative humidity) or less
 Storage period: One year or less
Note: Humidity means Relative Humidity.
15.1.2 After Opening the Dry Packing
The following are required storage conditions after opening the dry packing (to prevent moisture absorption):
 Storage conditions for one-time soldering:
– Temperature: 5~25℃
– Humidity: 60% or less