User's Manual

TiWi-C-W Module

APPLICATION GUIDE

The information in this document is subject to change without notice.

Table of Contents

1 Introduction ................................................................................................................... 3

1.1 Purpose & Scope ....................................................................................................................... 3

1.2 Applicable Documents ............................................................................................................... 3

2 TiWi-C-W Module and Accessories .............................................................................. 4

3 TiWi-C-W Approved Antenna Specifications ............................................................... 5

3.1 Chip Antenna Specifications...................................................................................................... 5

3.2 LSR FlexPIFA Antenna Specifications ...................................................................................... 7

3.3 Dipole Antenna Specifications ................................................................................................. 11

4 PCB Layout Requirements ......................................................................................... 14

4.1 4-Layer Trace Antenna Design................................................................................................ 15

4.2 2-Layer Trace Antenna Design................................................................................................ 21

5 EMC Compliance ......................................................................................................... 26

5.1 Summary ................................................................................................................................. 26

5.2 Module Integration Considerations - Antenna Systems .......................................................... 26

5.3 Module Integration Considerations - Substitute Antenna Systems ......................................... 26

5.4 Module Integration Considerations - Circuit Implementation .................................................. 27

5.5 Module Integration Considerations - Top Assembly................................................................ 27

5.6 Testing Requirements for End-Product ................................................................................... 27

5.7 Design and Production Validation ........................................................................................... 27

5.8 Agency Certifications ............................................................................................................... 28

5.9 Agency Statements ................................................................................................................. 28

5.10 OEM Responsibilities To Comply With FCC and Industry Canada Regulations .................... 30

5.11 OEM Labeling Requirements For End-Product ....................................................................... 31

5.12 OEM End-Product User Manual Statements ........................................................................... 32

6 Contacting LSR ........................................................................................................... 33