Data Sheet
Table Of Contents
- 1 Overview and Key Features
- 1.2 Application Areas
- Features and Benefits
- 2 Specifications
- 3 Hardware Specifications
- 3.1 Block Diagram and Pin-out
- 3.2 Pin Definitions
- 3.3 Electrical Specifications
- 4 Functional Description
- 4.1 Power Management (includes brown-out and power on reset)
- 4.2 Clocks and Timers
- 4.3 RF
- 4.4 UART Interface
- 4.5 SPI Bus
- 4.6 I2C Interface
- 4.7 General Purpose I/O, ADC and PWM/FREQ
- 4.8 nRESET Pin
- 4.9 nAutoRUN Pin
- 4.10 RM1xx VSP Service and Modes
- 4.11 Two-Wire SWD Programming/Debug Interface
- 4.12 RM1xx on-board chip antenna characteristics
- 5 Hardware Integration Suggestions
- 6 Mechanical Details
- 7 Application Note for Surface Mount Modules
- 8 FCC and IC Regulatory Statements
- 9 CE Regulatory
- 10 EU Declarations of Conformity
- 11 Ordering Information
- 12 Bluetooth SIG Qualification
RM1xx LoRa/BLE Modules
Datasheet
https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions
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7 APPLICATION NOTE FOR SURFACE MOUNT MODULES
7.1 Introduction
Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application
note is intended to provide additional guidance beyond the information that is presented in the User Manual. This
Application Note is considered a living document and will be updated as new information is presented.
The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to
manufacture and conform to current automated manufacturing processes.
Shipping
Figure 11: RM1xx Shipping Tray Details
Modules are shipped in ESD (Electrostatic
Discharge) safe trays that can be loaded into
most manufacturers pick and place machines.
Layouts of the trays are provided in Figure 11.