Data Sheet
Table Of Contents
- 1 Overview and Key Features
- 1.2 Application Areas
- Features and Benefits
- 2 Specifications
- 3 Hardware Specifications
- 3.1 Block Diagram and Pin-out
- 3.2 Pin Definitions
- 3.3 Electrical Specifications
- 4 Functional Description
- 4.1 Power Management (includes brown-out and power on reset)
- 4.2 Clocks and Timers
- 4.3 RF
- 4.4 UART Interface
- 4.5 SPI Bus
- 4.6 I2C Interface
- 4.7 General Purpose I/O, ADC and PWM/FREQ
- 4.8 nRESET Pin
- 4.9 nAutoRUN Pin
- 4.10 RM1xx VSP Service and Modes
- 4.11 Two-Wire SWD Programming/Debug Interface
- 4.12 RM1xx on-board chip antenna characteristics
- 5 Hardware Integration Suggestions
- 6 Mechanical Details
- 7 Application Note for Surface Mount Modules
- 8 FCC and IC Regulatory Statements
- 9 CE Regulatory
- 10 EU Declarations of Conformity
- 11 Ordering Information
- 12 Bluetooth SIG Qualification
RM1xx LoRa/BLE Modules
Datasheet
https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions
25
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Figure 8: Wiring for 2-Wire SWD Programming/Debug Interface connector to SWD Programming/Debug interface on RM1xx module
4.12 RM1xx on-board chip antenna characteristics
The RM1xx on-board chip monopole antenna radiated performance depends on the host PCB layout.
RM1xx development board was used for RM1xx development and antenna performance evaluation. To obtain similar
performance follow guidelines in section PCB Layout on Host PCB for RM1xx to allow the on-board antenna to radiate and
reduce proximity effects due to nearby host PCB GND copper or metal covers.
RM1xx on-board antenna part number: ACX: AT5020-E3R0HBANT/LF
5 HARDWARE INTEGRATION SUGGESTIONS
5.1 Circuit
The RM1xx-series module is easy to integrate requiring no external components on the customer’s board apart from those
required by customer for development and in customers end application.
Checklist (for Schematic):
VCC
The module Vcc should be chosen to optimize either range or power consumption and must be within the valid
operating range and noise/ripple specification of RM1xx. Pins VCC_BLE and VCC_LORA should be tied together and
decoupling capacitors for filtering should be added close to the module VCC pins. The supply must be able to deliver
enough current for the sum of the BLE and LoRa transmitter currents for the chosen Vcc (plus reasonable headroom).
Power-on reset circuitry within RM1xx series module incorporates brown-out detector, thus simplifying power supply
design. Upon application of power, the internal power-on reset ensures module starts correctly.
AIN (ADC) and SIO pin IO voltage levels
RM1xx SIO operating voltage levels are from 0V to VCC. Ensure input voltage levels into SIO do not exceed VCC also (if
VCC source is a battery whose voltage will drop). Ensure ADC pin maximum inpu voltage for damage is not violated.
AIN (ADC) impedance and external voltage divider setup
If one wanted to measure with ADC, a voltage higher than 3.6V then one can connect a high impedance voltage
divider to lower the voltage to the ADC input pin. Other methods are to use a voltage buffer or FET transistor in
conjunction with a low resistance voltage divider.
High impedance values of a voltage divider connected to an AIN pin will introduce ADC inaccuracy. Laird recommends
the following solution for setup of a voltage divider when used with the RM1xx ADC:
– Connect a capacitor between AIN and ground (if the voltage divider presents high impedance).
Normally, when ADC is not sampling, the ADC (AIN) impedance is a very high value and can be
considered an open circuit. The moment ADC is sampling, ADC (AIN) impedance is 200k-600k and
lowers the AIN voltage. However, when the capacitor is connected it should keep the AIN voltage at
JP1
FTSH-105
1
2
3
4
5
6
7
8
9
10
SWDCLK
VCC_IO
nRESET/SWDIO
GND
(RM1xx Pin 22)
(RM1xx Pin 23)