Data Sheet

LC840PA
Datasheet
https://www.lairdconnect.com
48
© Copyright 2021 Laird Connectivity
All Rights Reserved
Americas: [phone]
Europe: [phone]
Hong Kong: [phone]
Figure 14: Reel/bag/box label
Figure 15: Carton label
Figure 16: MSL label
8.3 Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain
desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If
directed to bake units on the card, see Table 26 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this
standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity
indicator card. Floor life for MSL (Moisture Sensitivity Level) four devices is 72 hours in ambient environment 30°C/60%RH.
Table 26: Recommended baking times and temperatures
MSL
125°C
Baking Temp.
90°C/≤ 5%RH
Baking Temp.
40°C/ ≤ 5%RH
Baking Temp.
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
4
11 hours
7 hours
37 hours
23 hours
15 days
9 days
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the
responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the
requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds. In addition, we recommend
that the LC840PA module does not go through the reflow process more than one time; otherwise the LC840PA
internal component soldering may be impacted.