Specifications

Table Of Contents
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The following package label is located on both sides of the master carton:
Figure 18: Master carton package label
The following is the packing slip label:
Figure 19: Packing slip label
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain
desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If
directed to bake units on the card, see Table 26 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this
standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity
indicator card. Floor life for MSL (Moisture Sensitivity Level) four devices is 72 hours in ambient environment 30°C/60%RH.
Table 26: Recommended baking times and temperatures
MSL
125°C
Baking Temp.
90°C/5%RH
Baking Temp.
40°C/ 5%RH
Baking Temp.
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
4
11 hours
7 hours
37 hours
23 hours
15 days
9 days