Technology Brief Class TD, Regulated SMPS and Intercooler Explained
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Technology Brief: Class TD, Regulated SMPS (R.SMPS™), and Intercooler®
The R.SMPS design is regulated to keep supply voltage rails at
optimum levels even when mains voltages sag due to external
conditions. Mains voltages can drop as much as 20% below nominal
before there is any effect on peak rail voltages.
Benefits: R.SMPS delivers full rail voltage to the output stage
even when mains current sags or uctuates signicantly, allowing
the amplier to exhibit consistent transient response and tight,
undistorted bass. Small size and high efciency contribute to the
extraordinary power density of the C Series.
Intercooler® Cooling System
Technology: The overall C Series amplier topology is exceptionally
efcient, from the power supply though the output stages.
Nevertheless, one must keep in mind how much power is passing
through the very compact chassis. The heat generated per watt of
output is far less than with conventional designs.
LAB GRUPPEN’s Intercooler® cooling system is unique in two
respects.First, rather than mounting output devices on large
aluminum ns, Intercooler utilizes a copper heat sink with thousands
of very small, louvered ns. Copper dissipates heat much more
effectively than aluminum, and the thousands of small ns vastly
increase the total area exposed to the cooling airow.
Many other ampliers mount the output devices on a heat sink in
a “cooling tunnel,” with the coolest air hitting only the rst output
device. The last devices, at the end of the tunnel, are exposed to
much warmer air. This uneven cooling makes the last device in the
tunnel more susceptible to premature failure. With the C Series,
however, all output devices are mounted in a row perpendicular to
the airow. Dual, variable speed fans force cool air into a pressure
chamber, from where it passes through the cooling ns for each
device. None receives “pre-heated” air for cooling.
Benefits: More efcient cooling ensures greater long-term reliability.
Parallel mounting of output devices in the cooling airow prevents
premature failure of the “least-cooled” devices.
Item no. CT-CS_v3 - 25.04.16