Datasheet

Kunze Folien GmbH · Raiffeisenallee 12a · 82041 Oberhaching · Phone: [phone] · Fax: [phone]
[e-mail] · www.heatmanagement.com
We disclaim all liability for
accuracy of this informa-
tion. Technical detail is
subject to change.
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original product
PROPERTIES
· High thermal conductivity
· Very low total thermal transfer resistance
· Fiberglass reinforced for mechanical stability
· Very flexible
· Quick and clean handling, superior process reliability
· No thermal paste required
· UL flammability rating: UL 94 V0 (FileNo: E337894)
HEATPAD® KU-CG is a berglass reinforced silicone foil lled with thermally conductive ceramics, hence its high thermal
conductivity. By implementing it, a very low total thermal resistance can be achieved. Its performance range and exibility
make it the ideal interface material for most applications.
High-performance thermally conductive
thermo-silicone KU-CG
PART KU- CG20 CG30 CG45  CG80
GENERALPROPERTIES
Material Fiberglass reinforced silicone
Filler Thermally conductive ceramic (Boron Nitride)
Colour Salmon
Gauge mm 0,2
-0,05 to +0,05
0,3
-0 to +0,1
0,45
-0,05 to +0,05
0,8
-0 to +0,1
Density g/cm³ 2,5 2,5 2,5 2,5
Outgassing (LMW Siloxane) ppm
∑
D3 - D10 = <10
MECHANICALPROPERTIES   
Tensile strength Mpa 25,9 24,1 20,4 9,3
Tear strength kN/m 70 69 68 24
Hardness (Shore A) 92 92 92 92
ELECTRICALPROPERTIES       
Breakdown Voltage (Voltage ramp)
1
V (AC) 5000 7000 10000 19999
Breakdown Voltage (Voltage steps)
2
V (AC) 2000 3000 5000 10000
Dielectric Constant (1 kHz ) 3,8 4,2 4,3 4,3
Volume Resistivity Ωm 1,8 x 10
12
1,8 x 10
12
1,2 x 10
12
1,0 x 10
12
THERMALPROPERTIES   
Thermal conductivity W/mK 1,9 1,9 1,9 1,9
Thermal resistance
3
(inch
2
) °C/W 0,30 0,45 0,65 1,05
Operating temperature °C -60 to +200 -60 to +200 -60 to +200 -60 to +200
High-performancethermallyconductivethermo-siliconeKU-CG
THERMALCONDUCTIVITY
(W/m·°K)
1,9
Electricallyinsulating
Issue date: 17.11.2010
1
Voltage ramp 1000 V/s
2
Step-by-step voltage
increments until dielectric
breakdown
3
Increase of thermal resis-
tance through adhesive by
about 0,1 °C/W