Owner manual

VMP3 Functional Description

29230.01.UG.VC.050727/091420

P R E L I M I N A R Y

2. Functional Description

The following chapters present more detailed, board level information about the VMP3

E²Brain™ High Performance PowerPC Processor VME board whereby the board components

and their basic functionality are discussed in general.

2.1 General Information

The VMP3 is comprised basically of the EB8541 E²Brain™ module and the EBC-VME3 carrier

board.

The EB8541 E²Brain™ module consists of the following:

• a Motorola MPC8541E Integrated Processor, Power QUICC III with a PPC e500 core

• a Board Process/Communications Controller (BPCC)

• System and Communications interfacing to the EBC-VME3 for:

•I²C bus

• LPC bus

• PCI bus

• CompactFlash (CF) interface

• Terminal and Console (T/C) serial interfacing

• Monitor and Control (M/C) interfacing

• Test and Programming (T/P) interfacing

• High Speed Serial (HSS) communications

• Communications Area Network (CAN) bus

• Fast Ethernet (FE)

• Gigabit Ethernet (TSE)

• Memory elements:

• Main memory DDR-I-SDRAM, soldered

• Soldered SRAM, backed-up using an auxiliary power line

• Soldered FLASH

• Serial EEPROM

• a BrainCAP™ heat sink for the EB8541

• Software

• Operating system

• Board support package

• Boot strap loader (NetBootLoader)

The EB8541 carrier board, EBC-VME3, consists of the following:

• a Tundra Universe II PCI-to-VME bridge and VME-bus connector for VME-bus system

interfacing

• PHYs, magnetics, and connectors for Gigabit Ethernet interfacing

• magnetics and connector for Fast Ethernet interfacing

• a Terminal connector for serial interfacing

• a PCI expansion connector for PCI peripheral interfacing

• an I/O expansion connector for additional system and communications interfacing

• two test and programming connectors for JTAG and ISP logic interfacing

• switches and LEDs for Monitor and Control interfacing

• an optional CompactFlash socket for Type I and II CF cards