Manual

Preface CP3002
Page vi ID 1042-9252, Rev. 2.0
P R E L I M I N A R Y
4.3.8 Status Register 2 (STAT2) .............................................................4 - 11
4.3.9 Board ID High Byte Register (BIDH) .............................................4 - 11
4.3.10 Board and PLD Revision Register (BREV) ...................................4 - 12
4.3.11 Geographic Addressing Register (GEOAD) ..................................4 - 12
4.3.12 Watchdog Timer Control Register (WTIM) ....................................4 - 13
4.3.13 Board ID Low Byte Register (BIDL) ..............................................4 - 15
4.3.14 LED Configuration Register (LCFG) .............................................4 - 16
4.3.15 LED Control Register (LCTRL) .....................................................4 - 17
4.3.16 General Purpose Output Register (GPOUT) .................................4 - 18
4.3.17 General Purpose Input Register (GPIN) .......................................4 - 19
5. Power Considerations .............................................................5 - 3
5.1 System Power ..........................................................................................5 - 3
5.1.1 CP3002 Baseboard .........................................................................5 - 3
5.1.2 Backplane .......................................................................................5 - 4
5.1.3 Power Supply Units .........................................................................5 - 4
5.1.3.1 Start-Up Requirement .............................................................5 - 4
5.1.3.2 Power-Up Sequence ...............................................................5 - 4
5.1.3.3 Tolerance ................................................................................5 - 5
5.1.3.4 Regulation ...............................................................................5 - 5
5.2 Power Consumption ................................................................................5 - 6
5.3 Power Consumption of CP3002 Accessories ..........................................5 - 8
5.4 Start-Up Currents of the CP3002 .............................................................5 - 8
6. Thermal Considerations .........................................................6 - 3
6.1 Board Internal Thermal Monitoring ..........................................................6 - 3
6.2 Processor Thermal Monitoring .................................................................6 - 3
6.2.1 Digital Thermal Sensor (DTS) .........................................................6 - 3
6.2.2 Adaptive Thermal Monitor ...............................................................6 - 3
6.2.3 Frequency/VID Control ...................................................................6 - 4
6.2.4 Clock Modulation .............................................................................6 - 4
6.2.5 Catastrophic Cooling Failure Sensor ..............................................6 - 4
6.3 Chipset Thermal Monitor Feature ............................................................6 - 5