User Manual

Introduction CP3002-RC/CP3002-RA
Page 1 - 8 ID 1039-3625, Rev. 1.0
P R E L I M I N A R Y
1.5 Technical Specification
Table 1-1: CP3002-RC/CP3002-RA Main Specifications
FEATURES SPECIFICATIONS
Processor and Memory
CPU The CP3002-RC/CP3002-RA supports the following microprocessor:
• Intel® Core™ i7-620LE (LV) processor, 2.0 GHz, 4 MB L3 cache
Further processor features:
• Two execution cores
• Intel® Hyper-Threading Technology (Intel® HT Technology)
• Intel® 64 Architecture
• Intel® Turbo Boost Technology
• Intel® Intelligent Power Sharing (IPS)
• System Memory interface with optimized support for dual-channel
DDR3 SDRAM memory at 1066 MHz with ECC
• Integrated 2D and 3D Graphics Engines
• DMI and FDI interfaces to the Intel® QM57 chipset
• Two x8 PCI Express 2.0 ports operating at 2.5 GT/s
Please contact Kontron for further information concerning the suitability of
other Intel processors for use with the CP3002-RC/CP3002-RA.
Memory Main Memory:
• Up to 8 GB, dual-channel DDR3 SDRAM memory with ECC running at
1066 MHz
Cache Structure:
• 64 kB L1 cache for each core
• 32 kB instruction cache
• 32 kB data cache
• 256 kB L2 shared instruction/data cache for each core
• 4 MB L3 shared instruction/data cache shared between both cores
FLASH Memory:
• Two redundant SPI Flash chips (2 x 8 MB) for uEFI BIOS
• Up to 32 GB NAND Flash via an onboard Serial ATA Flash module
(SSD)
Serial EEPROM with 64 kbit
Chipset
Intel® QM57 Mobile Intel® QM57 Express Chipset:
• Two x4 or eight x1 PCI Express 2.0 ports operating at 2.5 GT/s (only one
x4 PCI Express port is used)
• SATA host controller with six ports, 3 Gbit/s data transfer rate and
RAID 0/1/5/10 support (only three ports are used, thus only RAID
0/1/5 support is available on the board)
• USB 2.0 host interface with up to 14 USB ports available (only two ports
are used)
• SPI Flash interface support
• Low Pin Count (LPC) interface
• PCI interface, 32-bit/33 MHz (not used)
• Power management logic support
• Enhanced DMA controller, interrupt controller, and timer functions
• System Management Bus (SMBus) compatible with most I²C™ devices
• DMI and FDI interfaces to the processor
• High Definition Audio (HDA) interface (not used)
• Analog display port
• Three digital display ports (not used)
• Integrated RTC