Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 0 Document History
- 1 Introduction
- 2 Product Concept
- 3 Application Interface
- 3.1 Operating Modes
- 3.2 Power Supply
- 3.3 Power-Up / Power-Down Scenarios
- 3.3.1 Turn on PLS8-X/PLS8-V
- 3.3.2 Signal States after Startup
- 3.3.3 Turn off PLS8-X/PLS8-V Using AT Command
- 3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line
- 3.3.5 Automatic Shutdown
- 3.3.5.1 Thermal Shutdown
- 3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions
- 3.3.5.3 Undervoltage Shutdown
- 3.3.5.4 Overvoltage Shutdown
- 3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency
- 3.4 Power Saving
- 3.5 RTC Backup
- 3.6 USB Interface
- 3.7 Serial Interface ASC0
- 3.8 UICC/SIM/USIM Interface
- 3.9 Digital Audio Interface
- 3.10 Inter IC Sound Interface (I2S)
- 3.11 Analog-to-Digital Converter (ADC)
- 3.12 GPIO Interface
- 3.13 Control Signals
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanics, Mounting and Packaging
- 7.1 Mechanical Dimensions of PLS8-X/PLS8-V
- 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform
- 7.2.1 SMT PCB Assembly
- 7.2.1.1 Land Pattern and Stencil
- 7.2.1.2 Board Level Characterization
- 7.2.2 Moisture Sensitivity Level
- 7.2.3 Soldering Conditions and Temperature
- 7.2.3.1 Reflow Profile
- 7.2.3.2 Maximum Temperature and Duration
- 7.2.4 Durability and Mechanical Handling
- 7.2.4.1 Storage Life
- 7.2.4.2 Processing Life
- 7.2.4.3 Baking
- 7.2.4.4 Electrostatic Discharge
- 7.3 Packaging
- 8 Sample Application
- 9 Reference Approval
- 10 Appendix
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PLS8-X/PLS8-V Hardware Interface Description
7.2 Mounting PLS8-X/PLS8-V onto the Application Platform
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PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Confidential / Released
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7.2 Mounting PLS8-X/PLS8-V onto the Application Platform
This section describes how to mount PLS8-X/PLS8-V onto the PCBs, including land pattern
and stencil design, board-level characterization, soldering conditions, durability and mechani-
cal handling. For more information on issues related to SMT module integration see also [3].
Note: Gemalto strongly recommends to solder all connecting pads for mechanical stability and
heat dissipation. Not only must all supply pads and signals be connected appropriately, but all
pads denoted as “Do not use“ should also be soldered (but not electrically connected). Note
also that in order to avoid short circuits between signal tracks on an external application's PCB
and various markings at the bottom side of the module, it is recommended not to route the sig-
nal tracks on the top layer of an external PCB directly under the module, or at least to ensure
that signal track routes are sufficiently covered with solder resist.
7.2.1 SMT PCB Assembly
7.2.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Gemalto M2M characteriza-
tions for lead-free solder paste on a four-layer test PCB and a 110 as well as a 150 micron-thick
stencil.
The land pattern given in Figure 32 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 6.5). Besides these pads there are ground areas
on the module's bottom side that must not be soldered, e.g., the position marker. To prevent
short circuits, it has to be ensured that there are no wires on the external application side that
may connect to these module ground areas.
Figure 32: Land pattern (top layer)