Datasheet

Page 2
Cu-ETP
C11000
KME 100 Industrial Rolled
Mechanical Properties (EN 1652)
Temper Tensile
Strength
Rm
Yield Strength
Rp
0.2
Elongation
Minimum
A
50mm
Hardness
HV *
MPa MPa % HV
R220 annealed 220 .. 260 < 140* 33 40 .. 65
R240 240 .. 300 ≥ 180 8 65 .. 95
R290 290 .. 360 ≥ 250 4 90 .. 110
R360 ≥ 360 ≥ 320 2 ≥ 110
* only for information
Fabrication Properties*
Cold Forming Properties Excellent
Hot Forming Properties
at 750 .. 950°C
Good
Machinability (Rating 20) Less suitable
Electroplating Properties Excellent
Hot Tinning Properties Excellent
Soft soldering Excellent
Resistance Welding Less suitable
Gas Shielded Arc Welding Less suitable
Laser Welding Less suitable
Soft Annealing 250 .. 500°C
Stress Relieving Annealing 150 .. 200°C
During heating in reducing atmosphere hydrogen can
penetrate inside the copper and react with Cu-Oxide to
water vapour. Its pressure can cause embrittlement.
Electrical Conductivity
Electrical conductivity is strongly influenced by chemical
composition. A high level of cold deformation and small
grain size decrease the electrical conductivity moderately.
Minimum conductivity level can be specified.
55
56
57
58
59
60
R200/R220 R240 R290 R360
Temper
E. Conductivity [MS/m]
Corrosion Resistance*
Resistant to:
Atmospheric corrosion: formation of the a greenish
protective patina due to the formation of copper basic
salts (such sulphates, chlorides in marine environment,
nitrates and carbonates). Cu-ETP is showing a good
resistance in in natural atmosphere.
Industrial and drinking water, aqueous and alkaline
solutions (excluding aqaueous solutions containing
cyanides, halgens, ammonia), pure water vapour
(steam), non oxidizing acids (without oxygen in
solution), neutral saline solutions.
Material can be heat-treated in reducing atmosphere.
Practically resistant against stress corrosion cracking
Not resistant to:
Oxidising acids, solutions containing cyanides,
ammonia or halogens, hydrosulfide, seawater.
* For more details call our technical service