User Manual

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nRF24L01+ Product Specification

Table 29. Recommended components (BOM) in nRF24L01+ with antenna matching network

11.1 PCB layout examples

Figure 33., Figure 34. and Figure 35. show a PCB layout example for the application schematic in Figure

32..

A double-sided FR-4 board of 1.6mm thickness is used. This PCB has a ground plane on the bottom layer.

Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of

critical components. A large number of via holes connect the top layer ground areas to the bottom layer

ground plane.

Part Designator Footprint Description

22pF

C1 0402 NPO, +/- 2%

22pF

C2 0402 NPO, +/- 2%

2.2nF C3 0402 X7R, +/- 10%

4.7pF C4 0402 NPO, +/- 0.25pF

1.5pF C5 0402 NPO, +/- 0.1pF

1,0pF C6 0402 NPO, +/- 0.1pF

33nF C7 0402 X7R, +/- 10%

1nF C8 0402 X7R, +/- 10%

10nF C9 0402 X7R, +/- 10%

8,2nH L1 0402 chip inductor +/- 5%

2.7nH L2 0402 chip inductor +/- 5%

3,9nH L3 0402 chip inductor +/- 5%

Not mounted

R1 0402

22k

Ω R2 0402 +/-1%

nRF24L01+ U1 QFN20 4x4

16MHz X1 +/-60ppm, C

=12pF

a. C1 and C2 must have values that match the crystals load capacitance, C

b. The nRF24L01+ and nRF24L01 application example and BOM are the same with the exception of

R1. R1 can be mounted for backward compatibility with nRF24L01. The use of a 1Mohm resistor

externally does not have any impact on crystal performance.