Datasheet
© 2017 Kingbright. All Rights Reserved. Spec No: DSAP0289 / 1203015591 Rev No: V.3B Date: 09/16/2017
Page 2 / 5
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at T
A
=25°C
Parameter Symbol
Value
Unit
Blue Hyper Red Green
Wavelength at Peak Emission I
F
= 20mA (typ) λ
peak
465 631 520 nm
Dominant Wavelength I
F
= 20mA (typ) λ
dom
[1]
470 624 525 nm
Spectral Bandwidth at 50% Φ REL MAX (typ)
I
F
= 20mA
Δλ 22 20 35 nm
Capacitance (typ) C 100 25 100 pF
Forward Voltage I
F
= 20mA (typ)
(max)
V
F
[2]
3.3
4.0
2.1
2.5
3.2
4.0
V
Reverse Current (V
R
= 5V) (max) I
R
50 10 50 uA
Temperature Coefficient of λ
peak
(typ)
I
F
= 20mA, -10°C ≤ T ≤ 85°C
TC
λpeak
0.04 0.13 0.05 nm/°C
Temperature Coefficient of λ
dom
(typ)
I
F
= 20mA, -10°C ≤ T ≤ 85°C
TC
λdom
0.03 0.06 0.03 nm/°C
Temperature Coefficient of V
F
(typ)
I
F
= 20mA, -10°C ≤ T ≤ 85°C
TC
V
-3.0 -1.9 -3.0 mV/°C
Parameter Symbol
Value
Unit
Blue Hyper Red Green
Power Dissipation P
D
120 75 120 mW
Reverse Voltage V
R
5 5 5 V
Junction Temperature T
j
115 125 115 °C
Operating Temperature T
op
-40 to +85 °C
Storage Temperature T
stg
-40 to +85 °C
DC Forward Current I
F
30 30 30 mA
Peak Forward Current I
FM
[1]
100 200 100 mA
Electrostatic Discharge Threshold (HBM)
-
8000 3000 8000 V
Thermal Resistance (Junction / Ambient)
1 chip on
R
th
JA
[2]
415 325 400 °C/W
Thermal Resistance (Junction / Solder point)
1 chip on
R
th
JS
[2]
310 190 325 °C/W
Thermal Resistance (Junction / Ambient)
3 chips on
R
th
JA
[2]
675 460 685 °C/W
Thermal Resistance (Junction / Solder point)
3 chips on
R
th
JS
[2]
310 210 410 °C/W
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Notes:
1. 1/10 Duty Cycle , 0.1ms Pulse Width .
2. R
th
JA,
R
th
JS
Results from mounting on PC board FR4 (pad size≥16 mm
2
per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
KPFA-3011BZ1RGZ1C-A132/F