Datasheet

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22
SWITCHING AND CONTROL
A GREATER MEASURE OF CONFIDENCE
3732
Quad 4×28, Ultra-High Density,
Reed Relay Matrix Card
448 one-pole crosspoints with bank configuration and backplane connection relays
MATRIX CONFIGURATION: Four banks, each with 4 rows by
28 columns of reed relays. Bank configuration and analog
backplane relays are included for additional matrix configura-
tions. Banks can be connected together via relays creating
dual 4×56 matrices or a single 4×112 matrix. Row expansion
is available using optional screw terminal accessories.
CONTACT CONFIGURATION: Single-pole form A.
CONNECTOR TYPE: Two 78-pin male D-shells.
MODEL 3732-ST-R SCREW TERMINAL OPTION: Provides ter-
minal block access and column jumper blocks for extended
row configurations including Dual 8×28 (1W), Single 8×28
(2W), and Single 16×28 (1W).
Typical Wire Size: #22 AWG with 0.062 inch O.D.; 88 con-
ductors per card maximum.
Maximum Wire Size: #16 AWG with 0.092 inch O.D.; 44
conductors per card maximum.
MODEL 3732-ST-C SCREW TERMINAL OPTION: Provides
terminal block access for Quad 4×28 (1W), Dual 4×28 (2W),
Dual 4×56 (1W), Single 4×56 (2W), and Single 4×112 (1W)
matrix configurations.
Typical Wire Size: #22 AWG with 0.062 inch O.D.; 88 con-
ductors per card maximum.
Maximum Wire Size: #16 AWG with 0.092 inch O.D.; 44
conductors per card maximum.
MAXIMUM SIGNAL LEVEL: 200VDC or peak AC, 0.75A
switched (1.2A carry), 15W/15VA max. switch power.
COMMON MODE VOLTAGE: 200VDC or peak AC between any
signal path to a signal path or ground.
VOLT-HERTZ LIMIT: 8×10
7
.
CONTACT LIFE: Reed: >10
9
operations no load, >8×10
6
opera-
tions @ 100V, 10mA.
EMR (Backplane): >10
8
operations @ 5V, 10mA and 10
5
opera-
tions at maximum signal level.
MODEL 3732 PARAMETERS
Parameter Quad 4×28
1, 2
Dual 4×56
1, 2
Single 4×112
1, 2
Dual 8×28
2, 3
Single 16×28
2, 3
Channel Resistance
(end of life)
<1.5 W <2.0 W <2.5 W <1.6 W <2.0 W
Contact Potential
(differential)
<±10 μV 20 μV N/A <±15 μV N/A
Contact Potential
(single ended)
20 μV <±40 μV <±65 μV <± 20 μV <±20 μV
Offset Current
0.5 nA <±1.0 nA <±2.0 nA <±1.0 n A <±2.0 nA
Isolation
CH-CH
3×10
9
W/150 pF 1.5×10
9
W/300 pF 7.5×10
8
W/600 pF 2×10
9
W/200 pF 1.5×10
9
W/300 pF
Common mode
1.5×10
9
W/300 pF 1.5×10
9
W/300 pF 7.5×10
8
W/600 pF 2×10
9
W/200 pF 1.5×10
9
W/300 pF
Crosstalk Ch-Ch
300 kHz
<–37 dB <37 dB <37 dB <37 dB <37 dB
1 MHz
<–26 dB <–26 dB <–26 dB <–26 dB <–26 dB
15 MHz
< –7 dB < –7 dB < 7 dB < 7 dB < –7 dB
Bandwidth
15 MHz 15 MHz 10 MHz 15 MHz 15 MHz
1. Connections made using Model 3732-ST-C.
2. Model 3706A mainframe with all DMM backplane relays disconnected.
3. Connections made using Model 3732-ST-R.
GENERAL SPECIFICATIONS
POWER BUDGET INFORMATION:
Quiescent Power Usage:
Mode Quiescent Power
Quad 4×28
780 mW
Dual 4×56
916 mW
Single 4×112
984 mW
Dual 8×28
780 mW
Single 16×28
780 mW
Channel Relay Power Consumption (each): 17mW.
Backplane Relay Power Consumption (each): 100mW.
For additional power-budgeting information, refer to the
Series 3700A Module Schematics and Connections section
in the Series 3700A User’s Manual (part no. 3700S-900-01).
ACTUATION TIME: 0.6ms.
RELAY TYPE: Reed (signal relays); EMR (backplane relays)
RELAY DRIVE SCHEME: Direct drive.
RELAY DRIVE CURRENT: 3.2mA.
INTERLOCK: Backplane relays disabled when terminal
assembly interlock signal removed. When asserted allows
system to read and save ID configuration bits.
EMC: Compliant with European Union EMC Directive.
SAFETY: Compliant with European Union Law Voltage
Directive.
OPERATING ENVIRONMENT: Specified for 0° to 50°C.
Specified to 70% relative humidity at 35°C.
STORAGE ENVIRONMENT: –25° to 65°C.
WEIGHT: 3.40 lbs (1.54kg).
Model 3732 specifications
Model 3732 specifications