Datasheet

Datasheet
TEK.COM16
General
IEEE-488 IEEE-488.1 compliant. Supports IEEE Std 488.2 common commands and status modeltopology.
USB Control (rear) USB 2.0 device, USB-TMC488 protocol.
RS-232 Baud rates from 300 bps to 115200 bps.
Ethernet RJ-45 connector, 10/100BaseT, Auto-MDIX.
Expansion Interface The TSP-Link expansion interface allows TSP-enabled instruments to trigger and communicate with
eachother.
Cable Type: Category 5e or higher LAN crossover cable.
3 meters (9.84 ft) maximum between each TSP-enabled instrument.
A maximum of 32 TSP-Link nodes can be interconnected.
Each source-measure instrument uses one TSP-Link node.
To Host
Computer
To Nodes 3–64
Node 1 Node 2
LXI Compliance Version 1.5 LXI Device Specification 2016 compliant.
LXI Timing Total Output Trigger Response Time: 245 μs minimum, 280 μs typical, (not specified) maximum.
Receive LAN[0-7] Event Delay: Unknown.
Generate LAN[0-7] Event Delay: Unknown.
Digital I/O Interface
+5VDC
5.1kW
100W
Solid State
Fuse
Read by
firmware
Written by
firmware
+5V Pins
(on DIGITAL I/O
connector)
Digital I/O Pi n
(on DIGITAL I/O
connector)
GND Pin
(on DIGITAL I/O
connector)
Rear Panel
Connector 25-pin female D.
Input/Output Pins 14 open drain I/O bits.
Absolute Maximum Input Voltage
5.25 V.
Absolute Minimum Input Voltage
–0.25 V.
Maximum Logic Low Input Voltage
0.7 V, +850 µA max.
Minimum Logic High Input Voltage
2.1 V, +570 µA.
Maximum Source Current (flowing out of Digital I/O bit)
+960 µA.
Maximum Sink Current @ Maximum Logic Low Voltage (0.7V)
–5.0 mA.
Absolute Maximum Sink Current (flowing into Digital I/O pin)
–11 m A .
5V Power Supply Pins Limited to 250 mA total for all three pins, solid-state fuse protected.