User's Manual

JO Y M A X M D 1 0 2 F C U s e r M a n u a l
V1.01
2
Revised History
Date Revision
Description
2011/01/03
1.0 1
st
Released
Table of Contents
1. Introduction...................................................................................................... 3
1.1 Key Features ......................................................................................... 3
1.1.1 Module........................................................................................... 3
1.1.2 Microcontroller ............................................................................. 3
1.2 Applications .......................................................................................... 3
2. Specifications.................................................................................................... 4
3. Pin Configurations ........................................................................................... 5
3.1 Pin Assignment ..................................................................................... 6
4. Additional Information .................................................................................... 8
4.1 Outline Drawing ................................................................................... 8
4.2 Module PCB Footprint......................................................................... 9
4.3 Ordering / Lable Information ............................................................ 10
4.4 Tape and Reel Information................................................................. 11
4.4.1 Tape Orientation and dimensions.................................................. 11
4.4.2 Cover tape details........................................................................... 11
4.4.3 Leader and Trailer ......................................................................... 12
4.4.4 Reel Dimensions............................................................................. 12
4.5 SMT IR Profile ................................................................................... 13
4.6 How to Avoid ESD Damage to ICs..................................................... 13
5. FCC Statement ............................................................................................... 14
6. IC Statement................................................................................................... 16
7. Contact Information ...................................................................................... 18