User's Manual

JO Y M A X M D 1 0 2 A C U s e r M a n u a l
V1.01
2
Revised History
Date Revision Description
2011/01/03 1.0 1
st
Released
Table of Contents
1. Introduction......................................................................................................3
1.1 Key Features .........................................................................................3
1.1.1 Module...........................................................................................3
1.1.2 Microcontroller .............................................................................3
1.2 Applications ..........................................................................................3
2. Specifications....................................................................................................4
3. Pin Configurations ...........................................................................................5
3.1 Pin Assignment .....................................................................................6
4. Additional Information....................................................................................8
4.1 Outline Drawing ...................................................................................8
4.2 Module PCB Footprint.........................................................................9
4.3 Ordering / Lable Information ............................................................ 10
4.4 Tape and Reel Information................................................................. 11
4.4.1 Tape Orientation and dimensions.................................................. 11
4.4.2 Cover tape details........................................................................... 11
4.4.3 Leader and Trailer.........................................................................12
4.4.4 Reel Dimensions.............................................................................12
4.5 SMT IR Profile ...................................................................................13
4.6 How to Avoid ESD Damage to ICs.....................................................13
5. FCC Statement ...............................................................................................14
6. IC Statement................................................................................................... 16
7. Contact Information ...................................................................................... 18