Data Sheet

Jovy Systems® Limited

Document reference

DS-SP-PS4 STCL-001

Revision

1.00

Date:

18/04/2014

Page

1 of 2

www.jovy-systems.com

JV- RMP4 Stencils - Datasheet

Product Overview:

Whenever a BGA component is removed from an assembly, the attachment balls must be replaced

before it can be reused. It's frustrating and very costly to throw away good components that could be

recovered with the right tools.

The unavailability of the new BGA components as replacement for damaged ones makes re-balling is the

only alternative.

JV-RMP4 is a package of PS4 most reworkable BGAs. Package contains 4 stencils for the following BGAs

- SCEI (Sony Computer Entertainment, Inc.) CXD90026G SoC

- SCEI CXD90025G Secondary/Low Power Processor for Network Tasks

- Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM

- Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM

Technical specifications

Technology used to make the stencils

Laser cut

Material used

Stainless Steel

Stencil thickness

0.30mm and 0.25mm (300 micron and 250

micron)

Aperture tolerance

6.35 micron

Product details

1- SCEI CXD90026G SoC package

Ball Size 0.55mm

PAGE 1
Jovy Systems® Limited Document reference DS-SP-PS4 STCL-001 Revision 1.00 Date: 18/04/2014 JV- RMP4 Stencils - Datasheet Product Overview: Whenever a BGA component is removed from an assembly, the attachment balls must be replaced before it can be reused. It's frustrating and very costly to throw away good components that could be recovered with the right tools. The unavailability of the new BGA components as replacement for damaged ones makes re-balling is the only alternative.
PAGE 2
Jovy Systems® Limited Document reference DS-SP-PS4 STCL-001 Revision 1.00 Date: 18/04/2014 2- SCEI CXD90025G Secondary/Low Power Processor for Network Tasks Ball Size: 0.40mm 3- Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM Ball Size: 0.40mm 4- Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM Ball Size: 0.40mm About Jovy Systems continues improve and develop the product lines according to the latest technology and operator’s requirements.