Additional Information
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Cost effective and Fast Process
Re-balling Solutions
Introduction
Cost effective, fast process and accurate results are the benefits provided
from JOVY™ Re-balling Kits series as a solution for the different types of IC
packages Re-balling.
Re-balling, is renewing the damaged solder ball joints in the IC packages for
reworking purposes, rather than using solder paste & stencils methodology
– which is depended on precious material for the stencil and on stencil
thickness - JOVY™ Re-balling solution mainly depends on eutectic sphere
solder balls and stencils for the most accurate results concerning the
methodology of Re-balling. Meanwhile the method of solder paste and
stencil mask methodology used in the mobile phone and part of the PS3 Re-
balling solutions.
Customizations; for customers' satisfaction JOVY™ offers the service of
producing a custom made stencil masks which it could be required from the
customers in any balls matrix, patterns or stencil thickness. Only customer
should provide complete data about the IC package details or simply by
submitting the IC package data sheet (which include all details in addition
to the package thermal profile).
JV-RKS
JV-RKG
JV-RKP
JV-RKX
JV-RKC