Data Sheet

Part number:WG7837-V1

Model name :WG7837-V0

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http://www.jorjin.com.tw

CONFIDENTIAL

11. SMT AND BAKING RECOMMENDATION

Baking Recommendation

 Baking condition：

Follow MSL Level 4 to do baking process.

After bag is opened, devices that will be subjected to reflow solder or other high temperature

process must be

a) Mounted within 72 hours of factory conditions <30°C/60% RH, or

b) Stored at <10% RH.

Devices require bake, before mounting, if Humidity Indicator Card reads >10%

If baking is required, Devices may be baked for 8 hrs at 125 °C.

SMT Recommendation

 Recommended Reflow profile：

Item Temperature (°C) Time (sec)

Pre-heat D1 to approximately D2: 140 to 200 T1: 80 to approximately 120

Soldering D2: 220 T2: 60 ± 10

Peak-Temp. D3: 250 maximum T3: 10

 Stencil thickness： 0.1~ 0.15 mm (Recommended)

 Soldering paste (without Pb)： Recommended SENJU N705-GRN3360-K2-V can get better

soldering effects.