User's Manual

Doc No: WG6611-00-DTS-D08

http://WWW.JORJIN.COM.TW

CONFIDENTIAL

Page 1

Index

1. HISTORY CHANGE ....................................................................................................................... 2

2. GENERAL DESCRIPTION ........................................................................................................... 3

3. FUNCTIONAL FEATURES ........................................................................................................... 4

3.1. MODULE BLOCK DIAGRAM .......................................................................................................... 4

3.2. PIN ASSIGNMENT (TOP VIEW) ....................................................................................................... 5

3.3. PIN DESCRIPTION ......................................................................................................................... 6

4. FUNCTIONAL SPECIFICATION ................................................................................................ 7

4.1. TEMPERATURE LIMIT RATINGS ................................................................................................... 10

4.2. DC POWER SUPPLY ............................................................................................................... 10

4.3. CURRENT CONSUMPTION ............................................................................................................ 11

4.4. WLAN 2.4-GHZ RF PERFORMANCE .......................................................................................... 12

4.5. PIN FUNCTION TABLE ................................................................................................................. 13

5. REFFERENCE SCHEMATIC ...................................................................................................... 14

5.1. APPLICATION REFERENCE CIRCUIT ............................................................................................ 14

6. PACKAGE INFORMATION ......................................................................................................... 15

6.1. MODULE MECHANICAL OUTLINE ................................................................................................ 15

6.2. PACKAGE MARKING ................................................................................................................... 17

7. SMT AND BAKING RECOMMENDATION ............................................................................. 18

7.1. BAKING RECOMMENDATION ...................................................................................................... 18

7.2. SMT RECOMMENDATION ........................................................................................................... 18