User's Manual

Doc No: WG6031-00-DTS-D02

http://WWW.JORJIN.COM.TW

CONFIDENTIAL

Page 12

8. SMT AND BAKING RECOMMENDATION

8.1. Baking Recommendation

 Baking condition：

- Follow MSL Level 4 to do baking process.

- After bag is opened, devices that will be subjected to reflow solder or other high

temperature process must be

a) Mounted within 72 hours of factory conditions <30°C/60% RH, or

b) Stored at <10% RH.

- Devices require bake, before mounting, if Humidity Indicator Card reads >10%

If baking is required, Devices may be baked for 8 hrs at 125 °C.

8.2. SMT Recommendation

 Recommended Reflow profile：