User's Manual

Doc No: WG1400-00-DTS-D05
Copyright © JORJIN TECHNOLOGIES INC. 2015
http://WWW.JORJIN.COM.TW
CONFIDENTIAL
Page 17
No. Item Temperature (°C) Time (sec)
1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120
2 Soldering D2: = 220 T2: 60 +/- 10
3 Peak-Temp. D3: 250 °C max
Note: (1) Reflow soldering is recommended two times maximum.
(2) Add Nitrogen while Reflow process： SMT solder ability will be better.
 Stencil thickness：
：：
： 0.1~ 0.13 mm (Recommended)
 Soldering paste (without Pb)：
：：
： Recommended SENJU N705-GRN3360-K2-V can get
better soldering effects.
8. HISTORY CHANGE
Revision
Date Description
0.1 2014/10/14 Initial Released
0.2 2015/03/13 1. Revise RF Specifications.
2. Redraw reference schematic.
3. Add Recommended Operating Conditions.
4. Add SMT AND BAKING RECOMMENDATION
0.3 2015/04/24 Revise the Ambient Temperature Range
0.4 2015/05/06 1. Add RF connector.
2. Revise the Recommended Operating Conditions.
0.5 2015/11/25 1. Add FCC statement.