Product Data Sheet

MF1S50yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 3 March 2014
279230 32 of 40
NXP Semiconductors
MF1S50yyX/V1
MIFARE Classic EV1 1K - Mainstream contactless smart card IC
16. Bare die outline
For more details on the wafer delivery forms, see Ref. 9.
(1) The air gap and thus the step size may vary due to varying foil expansion
(2) All dimensions in µm, pad locations measured from metal ring edge (see detail)
Fig 25. Bare die outline MF1S50yyXDUz/V1
LA
LB
VSS
43
43
238
x
y
TESTIO
x [µm] y [µm]
658
(1)
60
713
(1)
60
Chip Step
Bump size
LA, LB, VSS, TEST
typ. 713
(1)
typ. 18
(1)
min. 5
typ. 18
(1)
min. 5
633
aaa-012193
typ. 658
(1)
578