Product Data Sheet

MF1S50yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 3 March 2014
279230 31 of 40
NXP Semiconductors
MF1S50yyX/V1
MIFARE Classic EV1 1K - Mainstream contactless smart card IC
Fig 24. Package outline SOT500-4
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT500-4 - - -
- - -
- - -
sot500-4_po
11-02-18
Unit
mm
max
nom
min
0.26 35.05
35.00
34.95
A
(1)
Dimensions
Note
1. Total package thickness, exclusive punching burr.
PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-4
D
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0 10 20 mm
scale
X
D
detail X
A