Datasheet

IXD_604
R02 www.clare.com 5
1.7 Thermal Characteristics
2 IXD_604 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
D2 (8-
Pin DFN)
Thermal Resistance, Junction-to-Ambient
θ
JA
35
°C/W
PI (8-Pin DIP)
125
SI (8-Pin Power SOIC)
85
SIA (8-Pin SOIC)
120
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Case
θ
JC
10
°C/W
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
INx
OUTx
10%
90%
t
ondly
t
offdly
t
r
t
f
V
IH
V
IL
INx
OUTx
ENAENB
INA OUTA
GND
V
CC
INB OUTB
V
CC
+
-
V
IN
0.1μF10μF
C
LOAD
Tektronix
Current Probe
6302
Tektronix
Current Probe
6302
C
LOAD