Datasheet

IXD_604
R02 www.clare.com 11
5.4 Mechanical Dimensions
5.4.1 SIA (8-
Pin SOIC)
5.4.2 SI (8-
Pin Power SOIC with Exposed Metal Back)
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.30 / 1.75
(0.051 / 0.069)
0.10 / 0.25
(0.004 / 0.010)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244)
3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
2. The exposed metal pad on the back of the SI package may be
left floating or connected to GND. It is not suitable for carrying
current.
1.30 / 1.75
(0.051 / 0.069)
0.03 / 0.10
(0.001 / 0.004)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244)
3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
2.29 / 2.79
(0.090 / 0.110)
3.30 / 3.81
(0.130 / 0.150)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)