Datasheet

DPG 60 C 300 HB
I
RMS
A
per pin
50
R
thCH
K/W0.25
M
D
Nm1.2
mounting torque
0.8
T
stg
°C150
storage temperature
-55
Weight g6
Symbol Definition
Ratings
typ. max.min.Conditions
RMS current
thermal resistance case to heatsink
Unit
I is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
F
C
N120
mounting force with clip
20
Ordering Delivering Mode Base Qty Code Key
Standard
Part Name
DPG 60 C 300 HB 502163Tube 30
XXXXXX
YYWW
Logo
Marking on product
DateCode
Assembly Code
abcdef
Product Marking
D
P
G
60
C
300
HB
Part number
Diode
HiPerFRED
extreme fast
Common Cathode
TO-247AD (3)
=
=
=
DPG60C300PC
DPG60C300QB
DPG60C400QB
DPG60C200QB
TO-263 (D2Pak)
TO-3P
TO-3P
TO-3P
Similar Part Package
1)
1
)
Marking on Product
DPG60C300HB
300
300
400
200
Voltage Class
Current Rating [A]
Reverse Voltage [V]
=
=
=
=
RMS
IXYS reserves the right to change limits, conditions and dimensions.
© 2007 IXYS all rights reserved
0629
Data according to IEC 60747and per diode unless otherwise specified