Datasheet

DPG 20 C 400PB
advanced
I
RMS
A
per pin*
35
R
thCH
K/W
0.50
M
D
Nm
0.6
mounting torque
0.4
T
st
g
°C
150
storage temperature
-55
Weight
g
2
C
B
F
A
H
G
L
K
J
D
N
M
E
R
Q
Dim. Millimeter Inches
Min. Max. Min. Max.
A 12.70 13.97 0.500 0.550
B 14.73 16.00 0.580 0.630
C 9.91 10.66 0.390 0.420
D 3.54 4.08 0.139 0.161
E 5.85 6.85 0.230 0.270
F 2.54 3.18 0.100 0.125
G 1.15 1.65 0.045 0.065
H 2.79 5.84 0.110 0.230
J 0.64 1.01 0.025 0.040
K 2.54 BSC 0.100 BSC
M 4.32 4.82 0.170 0.190
N 1.14 1.39 0.045 0.055
Q 0.35 0.56 0.014 0.022
R 2.29 2.79 0.090 0.110
Symbol Definition
Ratings
typ. max.min.
Conditions
RMS current
thermal resistance case to heatsink
Unit
* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
Outlines
TO-220AB
F
C
N
60
mounting force with clip
20
IXYS reserves the right to change limits, conditions and dimensions.
© 2006 IXYS all rights reserved
0629
* Data according to IEC 60747and per diode unless otherwise specified