Datasheet

DHG 10 I 1200PM
advanced
I
RMS
A
per pin*
35
R
thCH
K/W
0.50
M
D
Nm
0.6
mounting torque
0.4
T
st
g
°C
150
storage temperature
-55
Weight
g
2
Symbol Definition
Ratings
typ. max.min.
Conditions
RMS current
thermal resistance case to heatsink
Unit
* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
Outlines
TO-220FPAC
F
C
N
60
mounting force with clip
20
IXYS reserves the right to change limits, conditions and dimensions.
© 2006 IXYS all rights reserved
0629
* Data according to IEC 60747and per diode unless otherwise specified