Specifications
Table Of Contents
www sziton com
RW6852S-50
V1.2 - May, 2022
. .
ITON Technology Corp.
Page 21 of 22
5.3 Package Information
Figure 6. Brief Packaging Process of RW6852S-50 Modules
6 . Thermal Reflow
Referred to IPC/ JEDEC standard.
Peak temperature: <250°C
Number of times: ≤2
Figure 7 . Recommended Reflow for Lead Free Solder
Note: The module is recommended not to go through reflow oven twice.