Data Sheet

Page 8
nRF51822 Product Specification v3.1
8.9 Serial Peripheral Interface (SPI) Master specifications ......................................................................57
8.10 I2C compatible Two Wire Interface (TWI) specifications..................................................................58
8.11 GPIO Tasks and Events (GPIOTE) specifications...................................................................................59
8.12 Analog to Digital Converter (ADC) specifications...............................................................................60
8.13 Timer (TIMER) specifications.......................................................................................................................61
8.14 Real Time Counter (RTC) ..............................................................................................................................61
8.15 Temperature sensor (TEMP) .......................................................................................................................61
8.16 Random Number Generator (RNG) specifications..............................................................................62
8.17 AES Electronic Codebook Mode Encryption (ECB) specifications.................................................62
8.18 AES CCM Mode Encryption (CCM) specifications ...............................................................................62
8.19 Accelerated Address Resolver (AAR) specifications...........................................................................62
8.20 Watchdog Timer (WDT) specifications ...................................................................................................63
8.21 Quadrature Decoder (QDEC) specifications .........................................................................................63
8.22 Non-Volatile Memory Controller (NVMC) specifications..................................................................64
8.23 General Purpose I/O (GPIO) specifications............................................................................................65
8.24 Low Power Comparator (LPCOMP) specifications..............................................................................65
9 Mechanical specifications ..................................................................................................................... 66
9.1 QFN48 package...............................................................................................................................................66
9.2 CDAB WLCSP package..................................................................................................................................67
9.3 CEAA WLCSP package...................................................................................................................................68
9.4 CFAC WLCSP package...................................................................................................................................69
10 Ordering information ............................................................................................................................ 70
10.1 Chip marking....................................................................................................................................................70
10.2 Inner box label.................................................................................................................................................70
10.3 Outer box label................................................................................................................................................71
10.4 Order code ........................................................................................................................................................71
10.5 Abbreviations...................................................................................................................................................72
10.6 Code ranges and values...............................................................................................................................73
10.7 Product options ..............................................................................................................................................75
11 Reference circuitry.................................................................................................................................. 76
11.1 PCB guidelines.................................................................................................................................................76
11.2 Reference design schematics.....................................................................................................................78
11.3 QFAA QFN48 package ..................................................................................................................................79
11.4 QFAB QFN48 package...................................................................................................................................85
11.5 QFAC QFN48 package...................................................................................................................................91
11.6 CDAB WLCSP package..................................................................................................................................97
11.7 CEAA WLCSP package................................................................................................................................ 103
11.8 CFAC WLCSP package................................................................................................................................ 109
12 Glossary ..................................................................................................................................................115