Data Sheet
Page 4
nRF51822 Product Specification v3.1
August 2014 3.0 Update to reflect the changes in build code:
• nRF51822-QFAA Hx0
• nRF51822-CEAA Ex0
• nRF51822-QFAB Cx0
(The x in the build codes can be any number between 0 and 9.)
If you are working with a previous revision of the chip, read version 2.x of the document.
Added content:
• Section 8.5.3 “Radio current consumption with DC/DC enabled” on page 50
• Section 11.1.1 “PCB layout example” on page 77
Updated content:
• Feature list on the front page.
• Section 2.1 “Block diagram” on page 10
• Section 3.2.1 “Code organization” on page 21
• Section 3.2.2 “RAM organization” on page 21
• Section 3.3 “Memory Protection Unit (MPU)” on page 22
• Section 3.4 “Power management (POWER)” on page 23
• Section 3.6 “Clock management (CLOCK)” on page 27
• Section 3.8 “Debugger support” on page 30
• Section 4.2 “Timer/counters (TIMER)” on page 32
• Chapter 5 “Instance table” on page 36
• Chapter 7 “Operating conditions” on page 38
• Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page 40
• Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page 41
• Section 8.1.4 “16 MHz RC oscillator (16M RCOSC)” on page 42
• Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page 43
• Section 8.1.7 “32.768 kHz Synthesized oscillator (32k SYNT)” on page 43
• Section 8.2 “Power management” on page 44
• Section 8.3 “Block resource requirements” on page 48
• Section 8.4 “CPU” on page 48
• Section 8.5.6 “Radio timing parameters” on page 54
• Section 8.5.7 “Antenna matching network requirements” on page 54
• Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications”
on page 55
• Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page 56
• Section 8.12 “Analog to Digital Converter (ADC) specifications” on page 60
• Section 8.13 “Timer (TIMER) specifications” on page 61
• Section 8.15 “Temperature sensor (TEMP)” on page 61
• Section 8.22 “Non-Volatile Memory Controller (NVMC) specifications” on page 64
• Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page 65
• Section 9.2 “CDAB WLCSP package” on page 67
• Section 10.7.2 “Development tools” on page 75
• Chapter 11 “Reference circuitry” on page 76
Date Version Description