User manual

AHHYTM_E2.2.1
6/23
Application Note
Humidity Module
HYT
Sensor picked on the active area with metal tweezers Sensor held with ngers without gloves
▪ Do not touch the active area of the sensor
▪ Do not use metal tweezers to handle the sensors
▪ Never handle the sensor by hand without gloves
▪ Avoid mechanical stress to the sensor, e.g. bending or touching the sensor with sharp objects
▪ Hold the sensor with plastic tweezers on the wires and side edges only
▪ Do not touch or scratch the active area of the sensors. Scratches and contaminations can degrade the sensor
characteristic (see bad examples below)
Sensor with contaminations Sensor with a scratch
1.5 Soldering of the Sensor
The 320 °C maximum temperature of the soldering iron may not be exceeded. Maximum heat applyed to the iron
or solder wave cannot exceed 10 s and only at the very end of the connecting wires.
Avoid soldering ux residues caused by the soldering process or any other contaminations inside the active area of
the sensor.
Soldering ux residues on the outside of the active sensor area are not critical.
If the sensor is mounted with glue, baking the sensor at 60 °C for 1 h after the gluing process is recommended.
1.6 Cleaning of the Sensor
Residues can be removed with isopropanol at room temperature. Applying low ultrasonic energy could improve the
cleaning process. The sensor must be dried after the cleaning process.
The sensor cannot be cleaned mechanically with cotton swabs.
It is possible to clean the sensor with oil free and ltered clean air, e.g. to remove dust particles.