Datasheet

IRG4BC30UDPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
E
G
n-channel
C
V
CES
= 600V
V
CE(on) typ.
= 1.95V
@V
GE
= 15V, I
C
= 12A
Parameter Min. Typ. Max. Units
R
θJC
Junction-to-Case - IGBT ------ ------ 1.2
R
θJC
Junction-to-Case - Diode ------ ------ 2.5 °C/W
R
θCS
Case-to-Sink, flat, greased surface ------ 0.50 ------
R
θJA
Junction-to-Ambient, typical socket mount ----- ----- 80
Wt Weight ------ 2 (0.07) ------ g (oz)
Thermal Resistance
UltraFast CoPack IGBT
11/3/03
Absolute Maximum Ratings
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 23
I
C
@ T
C
= 100°C Continuous Collector Current 12
I
CM
Pulsed Collector Current 92 A
I
LM
Clamped Inductive Load Current 92
I
F
@ T
C
= 100°C Diode Continuous Forward Current 12
I
FM
Diode Maximum Forward Current 92
V
GE
Gate-to-Emitter Voltage ± 20 V
P
D
@ T
C
= 25°C Maximum Power Dissipation 100
P
D
@ T
C
= 100°C Maximum Power Dissipation 42
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw. 10 lbf•in (1.1 N•m)
Benefits
• Generation -4 IGBT's offer highest efficiencies
available
• IGBTs optimized for specific application conditions
• HEXFRED diodes optimized for performance with
IGBTs . Minimized recovery characteristics require
less/no snubbing
• Designed to be a "drop-in" replacement for equivalent
industry-standard Generation 3 IR IGBTs
PD-94810
W
T
O
-22
0
AB
www.irf.com 1
• Lead-Free
• UltraFast: Optimized for high operating
frequencies 8-40 kHz in hard switching, >200
kHz in resonant mode
Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
Generation 3
• IGBT co-packaged with HEXFRED
TM
ultrafast,
ultra-soft-recovery anti-parallel diodes for use in
bridge configurations
Industry standard TO-220AB package

Summary of content (10 pages)