Datasheet
IRF7343PbF
2 www.irf.com
Surface mounted on FR-4 board, t ≤ 10sec.
Parameter Min. Typ. Max. Units Conditions
N-Ch 55 V
GS
= 0V, I
D
= 250µA
P-Ch -55 V
GS
= 0V, I
D
= -250µA
N-Ch 0.059 Reference to 25°C, I
D
= 1mA
P-Ch 0.054 Reference to 25°C, I
D
= -1mA
0.043 0.050 V
GS
= 10V, I
D
= 4.7A
0.056 0.065 V
GS
= 4.5V, I
D
= 3.8A
0.095 0.105 V
GS
= -10V, I
D
= -3.4A
0.150 0.170 V
GS
= -4.5V, I
D
= -2.7A
N-Ch 1.0 V
DS
= V
GS
, I
D
= 250µA
P-Ch -1.0 V
DS
= V
GS
, I
D
= -250µA
N-Ch 7.9 V
DS
= 10V, I
D
= 4.5A
P-Ch 3.3 V
DS
= -10V, I
D
= -3.1A
N-Ch 2.0 V
DS
= 55V, V
GS
= 0V
P-Ch -2.0 V
DS
= -55V, V
GS
= 0V
N-Ch 25 V
DS
= 55V, V
GS
= 0V, T
J
= 55°C
P-Ch -25 V
DS
= -55V, V
GS
= 0V, T
J
= 55°C
I
GSS
Gate-to-Source Forward Leakage N-P ±100 V
GS
= ±20V
N-Ch 24 36
P-Ch 26 38
N-Ch 2.3 3.4
P-Ch 3.0 4.5
N-Ch 7.0 10
P-Ch 8.4 13
N-Ch 8.3 12
P-Ch 14 22
N-Ch 3.2 4.8
P-Ch 10 15
N-Ch 32 48
P-Ch 43 64
N-Ch 13 20
P-Ch 22 32
N-Ch 740
P-Ch 690
N-Ch 190 pF
P-Ch 210
N-Ch 71
P-Ch 86
V
(BR)DSS
Drain-to-Source Breakdown Voltage
∆V
(BR)DSS
/∆T
J
Breakdown Voltage Temp. Coefficient
R
DS(ON)
Static Drain-to-Source On-Resistance
V
GS(th)
Gate Threshold Voltage
g
fs
Forward Transconductance
I
DSS
Drain-to-Source Leakage Current
Q
g
Total Gate Charge
Q
gs
Gate-to-Source Charge
Q
gd
Gate-to-Drain ("Miller") Charge
t
d(on)
Turn-On Delay Time
t
r
Rise Time
t
d(off)
Turn-Off Delay Time
t
f
Fall Time
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
V/°C
Ω
V
S
µA
nC
ns
N-Channel
I
D
= 4.5A, V
DS
= 44V, V
GS
= 10V
P-Channel
I
D
= -3.1A, V
DS
= -44V, V
GS
= -10V
N-Channel
V
DD
= 28V, I
D
= 1.0A, R
G
= 6.0Ω,
R
D
= 16Ω
P-Channel
V
DD
= -28V, I
D
= -1.0A, R
G
= 6.0Ω,
R
D
= 16Ω
N-Channel
V
GS
= 0V, V
DS
= 25V, = 1.0MHz
P-Channel
V
GS
= 0V, V
DS
= -25V, = 1.0MHz
N-Ch
P-Ch
Parameter Min. Typ. Max. Units Conditions
N-Ch 2.0
P-Ch -2.0
N-Ch 38
P-Ch -27
N-Ch 0.70 1.2 T
J
= 25°C, I
S
= 2.0A, V
GS
= 0V
P-Ch -0.80 -1.2 T
J
= 25°C, I
S
= -2.0A, V
GS
= 0V
N-Ch 60 90
P-Ch 54 80
N-Ch 120 170
P-Ch 85 130
Source-Drain Ratings and Characteristics
I
S
Continuous Source Current (Body Diode)
I
SM
Pulsed Source Current (Body Diode)
V
SD
Diode Forward Voltage
t
rr
Reverse Recovery Time
Q
rr
Reverse Recovery Charge
A
V
ns
nC
N-Channel
T
J
= 25°C, I
F
=2.0A, di/dt = 100A/µs
P-Channel
T
J
= 25°C, I
F
= -2.0A, di/dt = 100A/µs
N-Channel I
SD
≤ 4.7A, di/dt ≤ 220A/µs, V
DD
≤ V
(BR)DSS
, T
J
≤ 150°C
P-Channel I
SD
≤ -3.4A, di/dt ≤ -150A/µs, V
DD
≤ V
(BR)DSS
, T
J
≤ 150°C
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 22 )
Notes:
Pulse width ≤ 300µs; duty cycle ≤ 2%.
N-Channel Starting T
J
= 25°C, L = 6.5mH R
G
= 25Ω, I
AS
= 4.7A.
P-Channel Starting T
J
= 25°C, L = 20mH R
G
= 25Ω, I
AS
= -3.4A.
nA










