Datasheet

IR2121 & (PbF)
2 www.irf.com
Parameter Value
Symbol Definition Min. Max. Units
V
CC
Fixed Supply Voltage -0.3 25
V
S
Gate Drive Return Voltage V
CC
- 25 V
CC
+ 0.3
V
O
Output Voltage V
S
- 0.3 V
CC
+ 0.3
V
IN
Logic Input Voltage -0.3 V
CC
+ 0.3
V
ERR
Error Signal Voltage -0.3 V
CC
+ 0.3
V
CS
Current Sense Voltage V
S
- 0.3 V
CC
+ 0.3
P
D
Package Power Dissipation @ T
A
≤ +25°C — 1.0 W
Rth
JA
Thermal Resistance, Junction to Ambient — 125 °C/W
T
J
Junction Temperature — 150
T
S
Storage Temperature -55 150 °C
T
L
Lead Temperature (Soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured
under board mounted and still air conditions.
Parameter Value
Symbol Definition Min. Max. Units
V
CC
Fixed Supply Voltage V
S
+ 12 V
S
+ 18
V
S
Gate Drive Return Voltage -5 5
V
O
Output Voltage V
S
V
CC
V
IN
Logic Input Voltage 0 V
CC
V
ERR
Error Signal Voltage 0 V
CC
V
CS
Current Sense Signal Voltage V
S
V
CC
T
A
Ambient Temperature -40 125 °C
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The V
S
offset rating is tested with all supplies biased at 15V differential.
V
V