Datasheet

2 www.irf.com
IR2011(S) & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
B
High side floating supply voltage -0.3 225
V
S
High side floating supply offset voltage V
B
- 25 V
B
+ 0.3
V
HO
High side floating output voltage V
S
- 0.3 V
B
+ 0.3
V
CC
Low side fixed supply voltage -0.3 25
V
LO
Low side output voltage -0.3 V
CC
+0.3
V
IN
Logic input voltage (HIN & LIN) -0.3 V
CC
+0.3
dV
s
/dt Allowable offset supply voltage transient (figure 2) — 50 V/ns
P
D
Package power dissipation @ T
A
£ +25°C (8-lead DIP) — 1.0
(8-lead SOIC) — 0.625
R
THJA
Thermal resistance, junction to ambient (8-lead DIP) — 125
(8-lead SOIC) — 200
T
J
Junction temperature — 150
T
S
Storage temperature -55 150
T
L
Lead temperature (soldering, 10 seconds) — 300
°C/W
W
V
°C
Note 1: Logic operational for V
S
of -4 to +200V. Logic state held for V
S
of -4V to -V
BS
.
Symbol Definition Min. Max. Units
V
B
High side floating supply absolute voltage V
S
+ 10 V
S
+ 20
V
S
High side floating supply offset voltage Note 1 200
V
HO
High side floating output voltage V
S
V
B
V
CC
Low side fixed supply voltage 10 20
V
LO
Low side output voltage 0 VCC
V
IN
Logic input voltage (HIN & LIN) COM 5.5
T
A
Ambient temperature -40 125 °C
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions. The V
S
and COM offset ratings
are tested with all supplies biased at 15V differential.
V