Datasheet
2 www.irf.com
IR2010(S)(TR) & (PbF)
(Please refer to the Design Tip DT97-3 for more details).
Note 1: Logic operational for V
S
of -4 to +200V. Logic state held for V
S
of -4V to -V
BS
.
Note 2: When V
DD
< 5V, the minimum V
SS
offset is limited to -V
DD.
Symbol Definition Min. Max. Units
V
B
High side floating supply absolute voltage V
S
+ 10 V
S
+ 20
V
S
High side floating supply offset voltage Note 1 200
V
HO
High side floating output voltage V
S
V
B
V
CC
Low side fixed supply voltage 10 20
V
LO
Low side output voltage 0 VCC
V
DD
Logic supply voltage V
SS
+ 3 V
SS
+ 20
V
SS
Logic supply offset voltage -5 (Note 2) 5
V
IN
Logic input voltage (HIN, LIN & SD) V
SS
V
DD
T
A
Ambient temperature -40 125 °C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V
S
and V
SS
offset ratings are tested with all supplies biased at 15V differential. Typical
ratings at other bias conditions are shown in figures 24 and 25.
V
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
B
High side floating supply voltage -0.3 225
V
S
High side floating supply offset voltage V
B
- 25 V
B
+ 0.3
V
HO
High side floating output voltage V
S
- 0.3 V
B
+ 0.3
V
CC
Low side fixed supply voltage -0.3 25
V
LO
Low side output voltage -0.3 V
CC
+ 0.3
V
DD
Logic supply voltage -0.3 V
SS
+ 25
V
SS
Logic supply offset voltage V
CC
- 25 V
CC
+ 0.3
V
IN
Logic input voltage (HIN, LIN & SD) V
SS
- 0.3 V
DD
+ 0.3
dV
s
/dt Allowable offset supply voltage transient (figure 2) 50 V/ns
P
D
Package power dissipation @ T
A
£ +25°C (14 lead DIP) 1.6
(16 lead SOIC) 1.25
R
THJA
Thermal resistance, junction to ambient (14 lead DIP) 75
(16 lead SOIC) 100
T
J
Junction temperature 150
T
S
Storage temperature -55 150
T
L
Lead temperature (soldering, 10 seconds) 300
°C/W
W
V
°C