Safety Information

Test Report
Report No. : TCT170727C902 Date : Aug. 01, 2017 Page No.: 18 of 32
Shenzhen TCT Testing Technology Co., Ltd.
1F, Building 1, Yibaolai Industrial Park, Qiaotou Village, Fuyong Town, Baoan District, Shenzhen, Guangdong
Hotline: [phone] Tel: [phone] Fax: [phone] http://www.tct-lab.com
Exemptions
RoHS Directive 2011/65/EU ANNEX III
Exemption Items
Expires Date
11(b), Lead used in other than C-press compliant pin connector
systems
Expires on 1 January 2013
and after that date may be
used in spare parts for EEE
placed on the market before 1
January 2013
12, Lead as a coating material for the thermal conduction module
C-ring
May be used in spare parts for
EEE placed on the market
before 24 September 2010
13(a), Lead in white glasses used for optical applications
13(b), Cadmium and lead in filter glasses and glasses used for
reflectance standards
14, Lead in solders consisting of more than two elements for the
connection between the pins and the package of micropro-cessors with
a lead content of more than 80 % and less than 85 % by weight
Expires on 1 January 2011
and after that date may be
used in spare parts for EEE
placed on the market before 1
January 2011
15, Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated circuit flip chip
packages
16, Lead in linear incandescent lamps with silicate coated tubes
Expires on 1 September 2013
17, Lead halide as radiant agent in high intensity discharge (HID)
lamps used for professional reprography applications
18(b), Lead as activator in the fluorescent powder (1 % lead by weight
or less) of discharge lamps when used as sun tanning lamps
containing phosphors such as BSP (BaSi
2
O
5
:Pb)
21, Lead and cadmium in printing inks for the application of enamels
on glasses, such as borosilicate and soda lime glasses
23, Lead in finishes of fine pitch components other than connectors
with a pitch of 0,65 mm and less
May be used in spare parts for
EEE placed on the market
before 24 September 2010
24, Lead in solders for the soldering to machined through hole
discoidal and planar array ceramic multilayer capacitors
25, Lead oxide in surface conduction electron emitter displays (SED)
used in structural elements, notably in the seal frit and frit ring
29, Lead bound in crystal glass as defined in Annex I (Categories 1, 2,
3 and 4) of Council Directive 69/493/EEC (
1
)
30, Cadmium alloys as electrical/mechanical solder joints to elec-trical
conductors located directly on the voice coil in transducers used in
high-powered loudspeakers with sound pressure levels of 100 dB (A)
and more
31, Lead in soldering materials in mercury free flat fluorescent lamps
(which e.g. are used for liquid crystal displays, design or industrial
lighting)
32, Lead oxide in seal frit used for making window assemblies for
Argon and Krypton laser tubes
33, Lead in solders for the soldering of thin copper wires of 100 μm
diameter and less in power transformers
34, Lead in cermet-based trimmer potentiometer elements