Datasheet

2
FN3180.5
July 21, 2005
Ordering Information
PART NUMBER
TEMP. RANGE
(°C) PACKAGE
PKG. DWG.
#
ICL7663SCBA* 0
to 70 8 Ld SOIC (N) M8.15
ICL7663SCBAZA*
(See Note)
0
to 70 8 Ld SOIC (N)
(Pb-free)
M8.15
ICL7663SCPA 0
to 70 8 Ld PDIP E8.3
ICL7663SCPAZ
(See Note)
0 to 70 8 Ld PDIP**
(Pb-free)
E8.3
ICL7663SACBA* 0
to 70 8 Ld SOIC (N) M8.15
ICL7663SACBAZA*
(See Note)
0 to 70 8 Ld SOIC (N)
(Pb-free)
M8.15
ICL7663SACPA 0
to 70 8 Ld PDIP E8.3
ICL7663SAIBA -25 to 85 8 Ld SOIC (N) M8.15
ICL7663SAIBAZA
(See Note)
-25
to 85 8 Ld SOIC (N)
(Pb-free)
M8.15
*Add “-T” suffix to part number for tape and reel packaging.
**Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
ICL7663S