Datasheet

9
FN3138.17
August 6, 2015
Absolute Maximum Ratings Thermal Information
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
CC
< 6V
V+ to Ground (Note 2. . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 13.2V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V
IN
< (V+ +0.3V)
R
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R
OUT
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
RXOUT
< (V+ +0.3V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Note 3) 
JC
(°C/W)
16 Ld PDIP Package* 90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be 0.1µF.
3. 
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: V
CC
= +5V ±10%, T
A
= Operating Temperature Range
PARAMETER TEST CONDITIONS
MIN
(Note 5) TYP
MAX
(Note 5) UNITS
SUPPLY CURRENTS
Power Supply Current, I
CC
No Load,
T
A
= +25°C
HIN232 - 5 10 mA
HIN236-HIN238, HIN240-HIN241 - 7 15 mA
HIN239 - 0.4 1 mA
V+ Power Supply Current, I
CC
No Load, T
A
= +25°C
No Load,
T
A
= +25°C
HIN239 - 5.0 15 mA
Shutdown Supply Current, I
CC
(SD) T
A
= +25°C - 1 10 µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
lL
T
IN
, EN, Shutdown - - 0.8 V
Input Logic High, V
lH
T
IN
2.0 - - V
EN
, Shutdown 2.4 - - V
Transmitter Input Pull-up Current, I
P
T
IN
= 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, V
OL
I
OUT
= 1.6mA - 0.1 0.4 V
TTL/CMOS Receiver Output Voltage High, V
OH
I
OUT
= -1.0mA 3.5 4.6 - V
RECEIVER INPUTS
RS-232 Input Voltage Range V
IN
-30 - +30 V
Receiver Input Impedance R
IN
V
IN
= ±3V 3.0 5.0 7.0 k
Receiver Input Low Threshold, V
lN
(H-L) V
CC
= 5V, T
A
= +25°C 0.8 1.2 - V
Receiver Input High Threshold, V
IN
(L-H) V
CC
= 5V, T
A
= +25°C - 1.7 2.4 V
Receiver Input Hysteresis V
HYST
0.2 0.5 1.0 V
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241