Datasheet

3
FN3138.17
August 6, 2015
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C) PACKAGE
PKG.
DWG. #
HIN232CBZ*
(Note)
HIN232CBZ 0 to +70 16 Ld SOIC
(Pb-free)
M16.3
HIN232CPZ
(Note)
HIN232CPZ 0 to +70 16 Ld PDIP**
(Pb-free)
E16.3
HIN232IBZ*
(Note)
HIN232IBZ -40 to +85 16 Ld SOIC
(Pb-free)
M16.3
HIN232IPZ
(Note)
HIN232IPZ -40 to +85 16 Ld PDIP**
(Pb-free)
E16.3
HIN236CBZ (No longer
available or supported
recommended replacement
part ICL3243E) (Note)
HIN236CBZ 0 to +70 24 Ld SOIC
(Pb-free)
M24.3
HIN237CBZ* (No longer
available or supported
recommended replacement
part ICL3243E) (Note)
HIN237CBZ 0 to +70 24 Ld SOIC
(Pb-free)
M24.3
HIN238CBZ*(Note) HIN238CBZ 0 to +70 24 Ld SOIC
(Pb-free)
M24.3
HIN238IBZ*
(Note)
HIN238IBZ -40 to +85 24 Ld SOIC
(Pb-free)
M24.3
HIN239CBZ*
(Note)
HIN239CBZ 0 to +70 24 Ld SOIC
(Pb-free)
M24.3
HIN239CPZ
(Note)
HIN239CPZ 0 to +70 24 Ld PDIP**
(Pb-free)
E24.3
HIN240CNZ* (No longer
available or supported) (Note)
HIN240CNZ 0 to +70 44 Ld MQFP
(Pb-free)
Q44.10X10
HIN241CAZ (No longer
available or supported) (Note)
HIN241CAZ 0 to +70 28 Ld SSOP
(Pb-free)
M28.209
HIN241CBZ* (No longer
available or supported) (Note)
HIN241CBZ 0 to +70 28 Ld SOIC
(Pb-free)
M28.3
HIN241IBZ (No longer
Available or supported) (Note)
HIN241IBZ -40 to +85 28 Ld SOIC
(Pb-free)
M28.3
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements
of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241