Datasheet

20
82C54
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
EE1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10) C
-C-
D2/E2
C
L
N28.45 (JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.165 0.180 4.20 4.57 -
A1 0.090 0.120 2.29 3.04 -
D 0.485 0.495 12.32 12.57 -
D1 0.450 0.456 11.43 11.58 3
D2 0.191 0.219 4.86 5.56 4, 5
E 0.485 0.495 12.32 12.57 -
E1 0.450 0.456 11.43 11.58 3
E2 0.191 0.219 4.86 5.56 4, 5
N28 286
Rev. 2 11/97