Datasheet

21
FN957.10
July 11, 2005
Metallization Mask Layout
Dimensions in parenthesis are in millimeters and are derived
from the basic inch dimensions as indicated. Grid graduations
are in mils (10
-3
inch).
The photographs and dimensions represent a chip when it is
part of the wafer. When the wafer is cut into chips, the cleavage
angles are 57
o
instead of 90
ο
with respect to the face of the
chip. Therefore, the isolated chip is actually 7 mils (0.17mm)
larger in both dimensions.
62-70
(1.575-1.778)
4-10
(0.102-0.254)
60
50
40
30
20
10
0
58-66
(1.473-1.676)
5040302010
61
0 60
65
CA3140, CA3140A