Product Data Sheet

BlueCore 01b Product Data Sheet
TM
bco1b-ds-003d
Product Data Sheet
Production Information
BlueCore 01b Product Data Sheet
TM
0
50
100
150
200
250
Time in minutes
0
24
Temperature ( C)°
0
50
100
150
200
250
0 2 4 6 8
1
0
1
2
1
4
1
6
1
8
2
0
2
2
0
Time in minutes
24
Temperature ( C)°
Figures 5 and 6 show the re-flow solder profile that was used to qualify the BlueCore01b packages.
This temperature profile was repeated three times during the qualification of the BlueCore01b packages with a
maximum temperature of 235°C.
Assembly Guidelines
Assembly Guidelines
Page 12 of 15
Whereas the above profile was used to confirm the reliablility of the BlueCore01b packages, the following
(figure 6) is the recommended solder profile to be used when assembling BlueCore01b onto a circuit board.
Recommended Re-flow Solder Profile
The recommended re-flow solder profile is shown in figure 6.
Important points to note are:
Maximum peak temperature should not exceed 220°C.
Time above liquidus should be between 45 to 90 seconds.
Rapid quenching provides superior cosmetic appearance and bond strength.
Figure 5: Re-flow solder profile 1
Figure 6: Re-flow solder profile 2
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