Datasheet

DYNATRON CORPORATION

NEW PRODUCT SPEC SHEET

R-th

0.32

0.35

0.38

0.41

0.44

11 14 17 20

Airflow (CFM)

Thermal Resistance (c/w)

R-th

Part Number: G129

• For Intel® Nehalem Processor, Socket LGA 1366

• Passive Heat Sink For Blade & 1U Server

• RoHS Compliant

Overall Specification:

• Dimension: 90.0mm x 88.0mm x 23.5mm

•

Weight: 465g ±5g

•

Material: Copper Heat Sink with Skiving Fins

•

Captive mounting design

•

Back Plate is not included

• Thermal Grease TIG830SP Pre-printed

• Thermal Power up to 95Watts

G129 Cooling Performance VS. System Airflow :

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DYNATRON CORPORATION NEW PRODUCT SPEC SHEET Part Number: G129 • • • For Intel® Nehalem Processor, Socket LGA 1366 Passive Heat Sink For Blade & 1U Server RoHS Compliant Overall Specification: • • • • • • • Dimension: 90.0mm x 88.0mm x 23.5mm Weight: 465g ±5g Material: Copper Heat Sink with Skiving Fins Captive mounting design Back Plate is not included Thermal Grease TIG830SP Pre-printed Thermal Power up to 95Watts G129 Cooling Performance VS. System Airflow : Thermal Resistance (c/w) R-th 0.44 0.