Intel Xeon Processor and Intel E7500/E7501Chipset Compatible Platform Design Guide
Intel
®
Xeon™ Processor and Intel
®
E7500/E7501 Chipset Compatible Platform Design Guide 157
I/O Controller Hub 3 (Intel
®
ICH3-S)
Probing VBIAS requires the same technique as probing the RTCX1 and RTCX2 signals (using
Op-Amp). See application note AP-728, Intel
®
ICH Family Real Time Clock (RTC) Accuracy and
Considerations Under Test Conditions, for further details on measuring techniques.
Note: VBIAS is also very sensitive to environmental conditions.
9.6.7 SUSCLK
SUSCLK is a square waveform signal output from the RTC oscillation circuit. Depending on the
quality of the oscillation signal on RTCX1 (largest voltage swing), SUSCLK duty cycle can be
between 30% and 70%.
If the SUSCLK duty cycle is beyond the 30%–70% range, there is a poor oscillation signal on
RTCX1 and RTCX2.
SUSCLK can be probed directly using a normal probe (50
Ω input impedance probe), and it is an
appropriate signal to check the RTC frequency to determine the accuracy of the ICH3-S RTC
clock.
9.6.8 RTC-Well Input Strap Requirements
All RTC-well inputs (RSMRST#, RTCRST#, INTRUDER#) must be either pulled up to VCCRTC
or pulled down to ground while in the G3 state. RTCRST#, when configured as shown in
Figure 9-11, meets this requirement. RSMRST# should have a weak external pull-down to ground,
and INTRUDER# should have a weak external pull-up to VCCRTC. This will prevent these nodes
from floating in G3, and correspondingly will prevent ICCRTC leakage that can cause excessive
coin-cell drain. The PWROK input signal should also be configured with an external weak
pull-down.